The Central Hardware Engineering Institute (CHEI) at Huawei Milan Research Center develops advanced computational methods and engineering technologies for next-generation ICT systems. Our work combines computational electromagnetics, numerical algorithms, software engineering, and high-speed interconnect design to create reusable methodologies that accelerate hardware development across multiple product generations.

We are looking for engineers who enjoy solving challenging computational and physical problems and transforming advanced numerical techniques into practical engineering tools used by hardware development teams worldwide.

Role Overview

You will develop computational methodologies, electromagnetic models, and engineering software for the analysis and optimization of high-speed interconnect systems. Working at the intersection of computational EM, numerical methods, and software engineering, you will create reusable workflows that enable faster, more reliable hardware design while collaborating closely with signal integrity and hardware engineers.

The role is ideal for candidates with strong computational and electromagnetic fundamentals who enjoy building robust engineering methodologies rather than performing one-off analyses.

Responsibilities

In this role, you will have the opportunity to:

· Develop computational electromagnetic methodologies for the modeling and optimization of high-speed interconnect systems.

· Design numerical algorithms and reusable software tools that improve engineering productivity, reproducibility, and scalability.

· Build physics-based models, reduced-order models, optimization workflows, and automation pipelines for complex engineering problems.

· Validate simulation results, assess numerical accuracy and convergence, and distinguish physical effects from numerical artifacts.

· Apply computational methods to practical engineering challenges involving PCBs, packages, connectors, cables, and complete communication channels.

· Collaborate with hardware and signal integrity engineers to translate computational results into actionable design guidelines.

· Contribute to the team's long-term technical roadmap through innovative methodologies, software infrastructure, and research.

What We're Looking For

We value strong analytical thinking, intellectual curiosity, and the ability to develop practical engineering solutions grounded in solid physical understanding.

Strong candidates bring:

· A solid theoretical foundation in Electrical Engineering, Physics, Applied Mathematics, Computational Science, or a related STEM discipline, demonstrated through an advanced degree and/or 5+ years of industrial or research experience.

· Strong understanding of computational electromagnetics, numerical methods, or scientific computing.

· Hands-on experience with electromagnetic simulation tools such as HFSS, CST, COMSOL, ADS, or equivalent computational frameworks.

· Experience developing engineering software, numerical algorithms, or automation workflows in Python, C++, MATLAB, or similar languages.

· The ability to critically evaluate simulation quality, verify numerical results, and reason from physical principles.

· Strong communication skills in English, including technical documentation and collaboration across multidisciplinary teams.

We welcome candidates from computational electromagnetics, RF engineering, antennas, microwave engineering, photonics, computational physics, packaging, applied mathematics, or related disciplines. Prior experience in high-speed signal integrity is valuable but not required.

Nice to Have

The following qualifications would make you an especially strong fit:

· Experience with signal integrity analysis for high-speed digital systems.

· Familiarity with transmission line theory, interconnect modeling, channel analysis, and impedance discontinuities.

· Experience with eye diagrams, BER analysis, TDR/TDT measurements, crosstalk analysis, or channel compliance.

· Familiarity with high-speed interface standards such as PCIe, Ethernet, DDR, USB, or SerDes.

· Experience with statistical SI techniques including Monte Carlo analysis, corner analysis, or Design of Experiments.

· Background in advanced packaging, chip-package co-design, or heterogeneous integration.

· Experience with model order reduction, surrogate modeling, optimization, uncertainty quantification, or machine learning for computational physics or electromagnetics.

Contributions to scientific publications, open-source engineering software, or novel computational

What We Offer

We offer you an exciting professional career in one of the leading and fastest growing multinational telecommunication companies, challenging work and a competitive salary package. Personal development is ensured through many training opportunities in Western Europe and abroad.

We offer a gross annual salary typically ranging from €60,000 to €75,000 determined according to objective criteria such as professional experience, competencies, and seniority. Employees may also be considered for a discretionary annual bonus ranging from 0 to 2 monthly salaries, subject to company evaluation. The applicable collective bargaining agreement is the CCNL Telecommunications, within levels 6° and 7°.

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Huawei is an Equal Opportunity Employer and do not discriminate based on race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, genetic information, or any other legally protected status. All qualified applicants will receive consideration for employment without regard to these characteristics. We are committed to creating an inclusive and diverse workplace

Company Info

Huawei Technologies Italia S.r.l.

Registered Office: Via Lorenteggio 240, Tower A, Milan

R&D Office address: Viale Martesana 12, 20055 Vimodrone (MI)