Central Hardware Engineering Institute (CHEI) at Huawei Milan Research Center focuses on advanced hardware technologies for next-generation ICT systems, with strong emphasis on high-speed interconnects, signal integrity (SI), and system-level performance optimization. The team develops both engineering solutions and internal methodologies/tools to enable robust, scalable hardware design.

Join the team and take ownership of signal integrity, from individual high-speed interconnects to system-level channel performance. You’ll deliver rigorous SI analysis on real products and build the reusable methods, workflows, and tooling that make the whole team faster and more scalable.

Role Overview

You will own signal integrity across the full design stack, from PCB and package to system-level interconnects, while building the reusable workflows and tooling that raise the team's efficiency on every project that follows.

Responsibilities

In this role, you will have the opportunity to:

· Own end-to-end signal integrity analysis for high-speed channels, from early-stage design to final validation.

· Drive optimization of PCB, package, and interconnect performance under real-world operating conditions.

· Develop and maintain engineering tools, scripts, and workflow automation that improve team efficiency and reproducibility.

· Build reusable electromagnetic modeling methodologies tailored to high-speed applications, creating lasting intellectual assets for the team.

· Translate SI analysis results into actionable design guidelines that directly support hardware development decisions.

· Shape the team's technical roadmap on high-speed interconnect directions, bringing in technical insights from both industry practice and academic research.

What We're Looking For

We value depth of understanding and a track record of delivering results. Strong candidates typically bring:

· A solid theoretical foundation in Electrical Engineering, Physics, or a related STEM field, demonstrated through an advanced degree and/or 5+ years of hands-on industrial experience.

· Familiarity with SI fundamentals: interconnect modeling, EM theory, and channel-level metrics such as eye diagrams, crosstalk, BER indicators, and TDR.

· Hands-on experience with EM, SI, or multiphysics simulation tools (e.g. HFSS, ADS, CST, COMSOL, SIwave), with the ability to critically assess simulation quality and the physical intuition to validate results and spot numerical artifacts.

· A software engineering mindset: experience building engineering tools or automation pipelines in Python or similar languages, going beyond one-off scripting.

· Clear and effective communication in English, including technical reporting and cross-functional collaboration.

We recognize that SI is a broad discipline, and that talented engineers from adjacent fields (EM modeling, RF, packaging, photonics, or numerical methods) can and do excel in this role. If you have strong fundamentals and a genuine drive to master the domain, we want to hear from you.

Nice to Have

The following are not required, but would make you an especially strong fit:

· Prior experience delivering SI results on real high-speed hardware systems, including TDR-based validation, differential signal analysis, and skew characterization.

· Familiarity with high-speed interface standards (PCIe, Ethernet, DDR, SerDes) and passive components.

· Experience with statistical SI analysis: Monte Carlo, worst-case corner analysis, or DoE.

· Background in advanced packaging, or chip-package co-design.

· Experience with model order reduction, surrogate modeling, or machine learning applied to SI/EM problems.

What We Offer

We offer you an exciting professional career in one of the leading and fastest growing multinational telecommunication companies, challenging work and a competitive salary package. Personal development is ensured through many training opportunities in Western Europe and abroad.

We offer a gross annual salary typically ranging from €60,000 to €75,000 determined according to objective criteria such as professional experience, competencies, and seniority. Employees may also be considered for a discretionary annual bonus ranging from 0 to 2 monthly salaries, subject to company evaluation. The applicable collective bargaining agreement is the CCNL Telecommunications, within levels 6° and 7°.

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Huawei is an Equal Opportunity Employer and do not discriminate based on race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, genetic information, or any other legally protected status. All qualified applicants will receive consideration for employment without regard to these characteristics. We are committed to creating an inclusive and diverse workplace

Company Info

Huawei Technologies Italia S.r.l.

Registered Office: Via Lorenteggio 240, Tower A, Milan

R&D Office address: Viale Martesana 12, 20055 Vimodrone (MI)