About Huawei

Huawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. With integrated solutions across four key domains – telecom networks, IT, smart devices, and cloud services – we are committed to bringing digital to every person, home and organization for a fully connected, intelligent world.

At Huawei, innovation focuses on customer needs. We invest heavily in basic research, concentrating on technological breakthroughs that drive the world forward. We have more than 200,000 employees, of which 55% are employed in R&D, and we operate in more than 170 countries and regions.

Huawei invests more than 20% of revenues in R&D every year: in the past 10 years our total R&D investments exceed 150B USD.

By the end of 2023, Huawei held +140.000 active patents.

Who we are

• Our motto is "make it possible", we use our customer-centric obsession, our perseverance, our dedication and a continuous self-challenge to accomplish the most challenging goals and always raise the bar!
• We think and execute very fast, but we are never superficial and always guarantee the highest standards.
• We are obsessed about continuous improvement and about creating value for the company, for the employees and for society.
• We are a multicultural team where relationships are informal and direct and where cooperation and support are our daily keywords.
• We are a place where "results talk and ideas walk", good ideas are always welcome, but you have to take ownership and make them happen too.
• Openness and flexibility are our mantra.

The Opportunity

We're looking for a talented Power Integrity Engineer that will be in charge of the exploration of board-level high-current PDN technologies, and the electromigration, through-current modeling and simulation, and performance evaluation of the interconnection microstructures such as the board power plane, BGA ball, and via.

Key Responsibilities

• Researched innovative technologies for low-loss and high-current power supply architecture, took charge of the electromigration and through-current capability improvement of 1000 A+ high-current PDNs, and resolved the through-current bottleneck and key technical challenges of boards and modules.
• Undertake board-level PDN technology development projects with low loss and large current, and support the competitiveness of large current and energy efficiency of the next-generation large-sized CPU.
• Build the capability of simulating and testing the electromigration of PDN microstructures (vias, bumps, and balls) under low voltage and high current.

Required Qualifications

• Master's degree or above, in Electrical Engineering, Computer Engineering, or Computer Science, PhD preferred.
• Have successful experience in developing power supply systems such as large chips and CPUs, and have a deep understanding of board-level power supply architecture, board-level PDN design, power encapsulation, and power conversion modules.
• Experience in developing simulation and testing of high current electromigration and through-current capability;
• Knowledge of PCB microstructure (vias and BGA balls), PCB surface treatment methods, and BGA solder materials;
• Excellent communication and presentation skills.
• Availability to travel
• Fluent knowledge of English is mandatory

Huawei Milan Research Center

This position is based in Huawei Milan Research Center. 

At our Research Center we work on cutting-edge technologies in microwave and millimeter-wave communications, focusing on frequency bands such as E-Band, W-Band, and D-Band.

Our research extends to free-space optical communications, advanced system architectures, antenna technologies, and contributions to standardization efforts. We also develop active phased array systems, focusing on innovative architectures and antenna array technologies.

Additionally, we are engaged in research on optical RFICs, including drivers and transimpedance amplifiers (TIAs), as well as microwave and millimeter-wave IC used in power amplifiers and front-end technologies.

Our research also covers HF technologies, advanced electromagnetics (EM), and also power integrity and high speed signal integrity in next-generation systems.

What We Offer

We offer you an exciting professional career in one of the leading and fastest growing multinational telecommunication companies, challenging work and a competitive salary package. Personal development is ensured through many training opportunities in Western Europe and abroad.

Privacy Statement

We therefore commit to protecting your privacy following the local legal data privacy legislation. Please read and understand our West European Recruitment Privacy Notice before submitting your personal data to Huawei so that you fully understand how we process and manage your personal data received (http://career.huawei.com/reccampportal/portal/hrd/weu_rec_all.html)

If you have any queries in regards to Huawei WEU Data Privacy please feel free to contact our WEU Data Protection Officer by clicking here (https://www.huawei.com/en/personal-data-request).

Company Info

Huawei Technologies Italia S.r.l.

Registered Office: Via Lorenteggio 240, Tower A, Milan

R&D Office address: Viale Martesana 12, 20055 Vimodrone (MI)